silver paste

基本解释

Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED热阻系统的构成，对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。
At present, rear-side aluminum paste has been basically achieved localization, localization rate of rear-side silver paste is rising.
目前背面铝浆已经基本实现国产化，背面银浆的国产化率也在提升。
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The experiment of looking for matching glass paste and silver paste, adjusting technology to obtaining glass sealed chip NTC thermistor were introduced.
为此调整了玻璃釉包覆片式NTC热敏电阻器所进行的工艺，进行了玻璃浆及银浆的选取和匹配工作。